High-voltage energy storage heat dissipation device

The heat dissipation of transient high voltage electronic equipment is analyzed. The more reliable natural heat dissipation method is adopted. Enhance heat dissipation by strengthening the heat conduction and sensible heat storage. Iron rod and ceramic are used to enhance heat conduction and heat storage.

Since high power resistors work in more severe enviornment than other high-power electronic devices, if the latent heat storage method is used, it is likely to experience a solid–liquid-gas phase transition because of the device's high temperature. It may cause the internal air pressure to be too high.

Few researchers, however, have studied the enhancement effect of sensible heat storage on the heat dissipation characteristics of electronic devices. In this research, the issue of an efficient transient heat dissipation method for the aluminum-shelled high-power resistor is raised.

Internal heat conduction and sensible heat storage continue to be the primary method of enhancing transient heat dissipation. To better evaluate the heat storage performance of the resistor, the concept of heat storage efficiency is put forward.

In this research, the issue of an efficient transient heat dissipation method for the aluminum-shelled high-power resistor is raised. The novelty of the current work is that under the principle of sensible heat storage, different sizes of iron rods are designed and inserted into the ceramic.

Active heat dissipation mainly includes forced air-cooling heat dissipation, forced liquid cooling and other methods. The following section will intuitively classify the heat management technologies based on the heat transfer method and cooling agent utilised by each technology.